Embedded Photonic Components for 100 Gbps Data Transport

Award Information
Agency:
Department of Energy
Branch
n/a
Amount:
$149,928.00
Award Year:
2012
Program:
SBIR
Phase:
Phase I
Contract:
DE-FG02-12ER90227
Award Id:
n/a
Agency Tracking Number:
99482
Solicitation Year:
2012
Solicitation Topic Code:
01 c
Solicitation Number:
DE-FOA-0000577
Small Business Information
990 Park Center Drive, Suite H, Vista, CA, 92081-8352
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
199060521
Principal Investigator:
Charles Kuznia
Dr.
(760) 652-0007
ckuznia@ultracomm-inc.com
Business Contact:
Charles Kuznia
Dr.
(760) 652-0007
ckuznia@ultracomm-inc.com
Research Institute:
Stub




Abstract
This program will develop technology for integrating optical interconnections within high performance ASIC packaging. This technology should eliminate the power associated with driving signals outside the package. The component must be capable of 100 Gbps data transmission overa -55 to 100C temperature range with less than 1 Watt of power consumption. This innovation to fiber optic component technology increases the performance, reduces the size and reduces the power consumption of optical communications within dense network systems, such as advanced distributed computing systems and data centers. VCSEL technology is enabling short-reach ( & lt;100m) 100 Gbps optical interconnections over multi-mode fiber in commercial applications. VCSEL technology offers a low power consumption ( & lt;10 mW/Gbps, uncooled) and low cost data links. The placement of fiber optic components within the ASIC assembly reduces the board level complexity and power consumption associated with the routing high speed signals over copper traces. To achieve this package integration, the component must be compatible with lead-free solder reflow temperature extremes. Concepts to reduce power through automatic measurement of the operating conditions (optical link loss, electrical eye opening, etc.) will be investigated. This technology will address the evolution of data transmission requirements, as the trend continues to implement optical components in close proximity to the data source/sink. The goal is to photonics to drastically increasing the transmission bandwidth available to high-performance ASICs. In the area of high-speed data transmission, the limitations of copper as a transmission media related to the absorption and dispersion of the energy in the printed circuit board (PCB) material are evident. Their limitations point towards fiber optics and the inherent speed and latency advantages of light in future design trends for ultra high-speed data transmissions. It is expected that optical transmission will be the definitive solution to certain PCB connectivity issues where it will become virtually impossible to route enough bandwidth at the box-to-box, backplane, circuit board and ultimately to the ASIC.

* information listed above is at the time of submission.

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