Digital Readout Infrared Focal Plane Array

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$99,967.00
Award Year:
2012
Program:
SBIR
Phase:
Phase I
Contract:
HQ0147-12-C-7808
Agency Tracking Number:
B112-005-0420
Solicitation Year:
2011
Solicitation Topic Code:
MDA11-005
Solicitation Number:
2011.2
Small Business Information
Black Forest Engineering, LLC
12930 Morris Trail, Colorado Springs, CO, -
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
621633296
Principal Investigator:
Steve Gaalema
President
(719) 593-9501
sgaalema@bfe.com
Business Contact:
Vivian McDonald
Office Administrator
(719) 593-9501
vmcdonald@bfe.com
Research Institution:
Stub




Abstract
Dual band infrared sensors are important components for future ballistic missile defense systems. Digital readout integrated circuits (DROICs), compared to analog ROIC architectures, allow on-chip processing, increased dynamic range and increased signal to noise ratio. Deep submicron CMOS provides low power digital circuitry with system noise immunity, and when combined with radiation hardening by design (RHBD) circuits, provides robust operation in the ballistic missile defense environment. On Phase I, Black Forest Engineering proposes to develop dual band 640x480 format DROIC circuitry with a 20µm pixel pitch that achieves more than equivalent well capacity of 50 million electrons, read noise less than 200 electrons, full frame rate of 240 Hz at two-bands, and power consumption less than 200 mW. The DROIC design will be compatible with existing dual band sequential HgCdTe detector arrays for demonstration of a DROIC-enabled focal plane array (FPA) on Phase II.

* information listed above is at the time of submission.

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