Next-Generation Micro-chip Carrier for Cooling of Satellite Payload Electronics

Award Information
Agency:
Department of Defense
Branch
n/a
Amount:
$149,947.00
Award Year:
2012
Program:
SBIR
Phase:
Phase I
Contract:
FA9453-12-M-0026
Award Id:
n/a
Agency Tracking Number:
F112-057-1506
Solicitation Year:
2011
Solicitation Topic Code:
AF112-057
Solicitation Number:
2011.2
Small Business Information
1000 A Pannell Street, Columbia, MO, -
Hubzone Owned:
Y
Minority Owned:
N
Woman Owned:
N
Duns:
808369792
Principal Investigator:
Peng Cheng
Thermal Engineer
(573) 239-4297
peng.cheng@thermavant.com
Business Contact:
Joe Boswell
President
(415) 264-0668
joe.boswell@thermavant.com
Research Institution:
Stub




Abstract
ABSTRACT: Miniature flat plate oscillating heat pipe (FP-OHP) heat spreaders using ThermAvant's patent-pending ThermalCircuit architecture and low CTE materials will be demonstrated in order to transfer 100-300W/cm2 from chip-sized heaters (1cm2 to 3cm2) to a heat sink area that rejects heat at<10W/cm2 with effective thermal conductivities>10,000W/mK. Prototypes will be modeled, designed, built and then tested using a combination of different FP-OHP channel architectures, materials, and fabrication techniques. Research will include thermal cycling and durability testing from -60 to +60C. Particular emphasis will be placed on using FP-OHP case materials with CTEs from 4-17 ppm/K that can be rapidly manufactured for low cost, short lead time military supply using additive manufacturing methods. BENEFIT: The developed heat spreader using low CTE materials (4-17 ppm/K) will be demonstrated to remove heat from 100-300W/cm2 devices at ultra low thermal resistances. A high volume, cost-effective manufacturing process for the spreader which is embedded with micro-scale oscillating heat pipe channels will be identified during Phase I. Because the spreader transfers heat through its internal channels rather than through its case material, the spreader can be made from a range of materials with CTEs that match the heat dissipating device. Near-term applications of the spreader include single-device and multi-device cooling of military devices with low CTEs such as power amplifiers, converters, ASICs, laser diodes, high power density power supplies, and IGBTs. For these near-term military applications and for longer-term commercial applications, single-step additive manufacturing techniques for embedding the channels within the spreader is critical for highly reliability and short-lead time supply. Longer term commercial applications include direct-contact-to-chip heat spreaders and heat sinks with ultra-low thermal resistance for cooling of computer CPU/GPUs, high-peak-power surgical lasers, and IGBTs in electric-vehicle power drives. Across a range of industries, the proposed technology will enable device designers to continue to increase device power and place them in ever smaller packages without being thermally constrained by excessive temperature build up that occurs with status quo heat spreading technologies.

* information listed above is at the time of submission.

Agency Micro-sites


SBA logo

Department of Agriculture logo

Department of Commerce logo

Department of Defense logo

Department of Education logo

Department of Energy logo

Department of Health and Human Services logo

Department of Homeland Security logo

Department of Transportation logo

Enviromental Protection Agency logo

National Aeronautics and Space Administration logo

National Science Foundation logo
US Flag An Official Website of the United States Government