Electroless Plating of Indium Bumps for High Operating Temperatures (HOT) Mid-Wave (MW) Sensors

Award Information
Agency:
Department of Defense
Branch
n/a
Amount:
$99,813.00
Award Year:
2012
Program:
SBIR
Phase:
Phase I
Contract:
W909MY-12-C-0045
Award Id:
n/a
Agency Tracking Number:
A121-039-0329
Solicitation Year:
2012
Solicitation Topic Code:
A12-039
Solicitation Number:
2012.1
Small Business Information
699 W Carob Place, Chandler, AZ, 85248
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
078453952
Principal Investigator:
Steve Cho
Chief Technology Officer
(602) 370-6382
stcho@EnerGaiatech.com
Business Contact:
Tony Maffia
Chief Executive Officer
(480) 748-0711
tmaffia@EnerGaiatech.com
Research Institute:
Stub




Abstract
Advanced hybrid packaging for MWIR FPA devices has considerable challenges in terms of increasing pixel density. These processes are based on Indium bumping; however, the current approach to deposition has scaling and cost issues. EnerGaia has a technology based on acoustic electroless deposition which can meet these requirements. Ultrasonic energy coupled to a plating solution has been proven to replace additives and improve uniformity by 40%. The additional energy source improves agitation, increases the kinetic energy of the ions, and reduces the boundary layer at deposition. Parameters such as grain size and crystal composition can be controlled. The EnerGaia process minimizes chemistry usage, which reduces cost as well as environmental waste.

* information listed above is at the time of submission.

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