Electroless Plating of Indium Bumps for High Operating Temperatures (HOT) Mid-Wave (MW) Sensors

Award Information
Agency: Department of Defense
Branch: Army
Contract: W909MY-12-C-0045
Agency Tracking Number: A121-039-0329
Amount: $99,813.00
Phase: Phase I
Program: SBIR
Awards Year: 2012
Solicitation Year: 2012
Solicitation Topic Code: A12-039
Solicitation Number: 2012.1
Small Business Information
699 W Carob Place, Chandler, AZ, 85248
DUNS: 078453952
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Steve Cho
 Chief Technology Officer
 (602) 370-6382
 stcho@EnerGaiatech.com
Business Contact
 Tony Maffia
Title: Chief Executive Officer
Phone: (480) 748-0711
Email: tmaffia@EnerGaiatech.com
Research Institution
 Stub
Abstract
Advanced hybrid packaging for MWIR FPA devices has considerable challenges in terms of increasing pixel density. These processes are based on Indium bumping; however, the current approach to deposition has scaling and cost issues. EnerGaia has a technology based on acoustic electroless deposition which can meet these requirements. Ultrasonic energy coupled to a plating solution has been proven to replace additives and improve uniformity by 40%. The additional energy source improves agitation, increases the kinetic energy of the ions, and reduces the boundary layer at deposition. Parameters such as grain size and crystal composition can be controlled. The EnerGaia process minimizes chemistry usage, which reduces cost as well as environmental waste.

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