Lightweight Electromagnetic Interference (EMI) Shielding System for Aircraft Avionics

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$79,998.00
Award Year:
2012
Program:
SBIR
Phase:
Phase I
Contract:
N68335-12-C-0073
Agency Tracking Number:
N112-097-1212
Solicitation Year:
2011
Solicitation Topic Code:
N112-097
Solicitation Number:
2011.2
Small Business Information
NEI Corporation
400 E Apgar Drive, Somerset, NJ, -
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
042939277
Principal Investigator:
Runqing Ou
Senior Scientist
(732) 868-3141
rou@neicorporation.com
Business Contact:
Ganesh Skandan
CEO
(732) 868-3141
gskandan@neicorporation.com
Research Institution:
Stub




Abstract
There is an unmet need in the US Navy for improved EMI shielding materials that can reduce signal interference between electronic equipment. Metals are a primary component in currently used EMI shields. Consequently, the shielding materials are heavy, and not optimally suitable for use in avionic electronic equipment. In the Phase I program, we propose to demonstrate the feasibility of a novel polymer/CNT nanocomposite material with enhanced electrical conductivity and EMI shielding effectiveness, compared to the state of the art metallic materials. A key aspect of the proposed program is that it utilizes a novel polymer morphology that results in a small concentration of CNTs leading to the desired electrical properties. The novel polymer/CNT nanocomposite material is expected to fulfill the materials property requirements for shielding avionic electronic equipment, particularly EMI shielding effectiveness and strength. A key advantage of the proposed nanocomposite material is that it can be made into a conductive heat shrink tubing, which can be applied to existing cable systems with a simple heat shrink treatment. The new materials will provide the Navy with a lightweight, durable, and long-lasting alternative to traditional metal braids. The Phase I program will demonstrate proof of concept on compression molded flat panels. The Phase II program will build upon the Phase I demonstration effort by implementing the technology in conductive heat shrink tubings for EMI shielding for the US Navy.

* information listed above is at the time of submission.

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