Large-Area, Rad-Hard, Near Infrared Focal Plane Array for Coherent Holographic LADAR Applications

Award Information
Agency: Department of Defense
Branch: N/A
Contract: FA8650-12-C-1363
Agency Tracking Number: F103-186-1959
Amount: $1,280,854.00
Phase: Phase II
Program: SBIR
Awards Year: 2012
Solicitation Year: 2010
Solicitation Topic Code: AF103-186
Solicitation Number: 2010.3
Small Business Information
Voxtel Inc.
15985 NW Schendel Avenue Suite 200, Beaverton, OR, 97006
DUNS: 000000000
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Adam Lee
 Senior Engineer
 (971) 223-5646
Business Contact
 George Williams
Title: President
Phone: (971) 223-5646
Research Institution
ABSTRACT: Voxtel proposes the development of a novel burst mode Wavefront/Wavefunction focal plane array (FPA), with a 64 64 InGaAs detector array composed of 36 36 m2 pixel elements with quantum efficiency greater than 95% across the near infrared (NIR) spectral range from 1 to 1.5 m. The FPAs sensitivity will be aided by a custom readout integrated circuit (ROIC) that features multiple amplitude samples per pixel (in support of burst mode operation), snapshot imaging with gating down to 100 ns, DC skimming for LO pedestal removal, correlated double sampling (CDS), region-of-interest (ROI) readout, and 4 parallel output ports, so that 1.5 kHz burst mode operation can be sustained. The Phase II work plan includes the design, fabrication, and electrical evaluation of the full-format (640 x 512) wavefunction sensor (WFS)-ROIC design. Following electrical evaluation, the WFS-ROIC will be optically demonstrated through hybridization to the InGaAs detector array. BENEFIT: The proposed technology is applicable to traditional LADAR markets, including 3D data for targeting, autonomous navigation, automotive cruise control and hazard avoidance. When scaled for commercial application, the innovation will have widespread application in the areas of medicine, engineering, optical computing, and gene sequencing.

* information listed above is at the time of submission.

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