Direct Digital Manufacturing (DDM) of Metallic Components: Controlled Thermal Processing

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N00014-12-C-0213
Agency Tracking Number: N102-166-0382
Amount: $746,402.00
Phase: Phase II
Program: SBIR
Awards Year: 2012
Solicitation Year: 2010
Solicitation Topic Code: N102-166
Solicitation Number: 2010.2
Small Business Information
Applied Optimization, Inc.
714 E Monument Ave Ste 204, Dayton, OH, -
DUNS: 838936599
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: Y
Principal Investigator
 Anil Chaudhary
 Principal Scientist
 (937) 431-5100
 anil@appliedo.com
Business Contact
 Katy Keenan
Title: Finance Manager
Phone: (937) 431-5100
Email: katy.keenan@appliedo.com
Research Institution
 Stub
Abstract
The first objective of this Phase II is to develop and demonstrate thermally controlled direct digital manufacturing (DDM) of Ti-6Al-4V that will have the ability to produce uniform/desired microstructure in a repeatable manner. The proposed method will be designed to provide a quasi steady and uniform state of thermal transport in the build and substrate material for the duration of deposition and subsequent cooling. The thermal control will be developed based on considerations such as the elimination of layered microstructure, minimization of beta grain size, transition from columnar to equiaxed microstructure, and to obtain morphology of microstructure that produces higher fatigue properties. The as-deposited material is anticipated to exhibit isotropic properties, with its fatigue properties in the upper bins of the Cast+HIP Ti-6Al-4V. An additional objective of this Phase II is to explore a method to induce vibration in the melt pool in order to further refine the prior-beta grains and to enhance the fatigue properties. The technology transition effort in Phase II Option will demonstrate the thermally controlled DDM to produce a representative complex geometry of interest to a jet engine OEM.

* information listed above is at the time of submission.

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