Electrically conductive aircraft transparency materials via Innlay surface-embedding

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N68335-12-C-0118
Agency Tracking Number: N102-120-0879
Amount: $749,535.00
Phase: Phase II
Program: SBIR
Awards Year: 2012
Solicitation Year: 2010
Solicitation Topic Code: N102-120
Solicitation Number: 2010.2
Small Business Information
1700 Owens St, Suite 240, San Francisco, CA, -
DUNS: 829972103
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: Y
Principal Investigator
 Michael Young
 Director of Technology De
 (415) 692-5410
Business Contact
 Alexander Mittal
Title: Chief Executive Officer
Phone: (415) 315-9462
Email: alex.mittal@innovadynamics.com
Research Institution
This Small Business Innovation Research (SBIR) Phase II project proposal to the U.S. Department of Defense, NAVAIR, Navy, outlines the plan for the qualification of robust, non-delaminating, highly conductive aircraft transparency materials using the Innlay (TM) surface-embedding technology platform. The technology approach addresses issues with existing electrical-shielding aircraft transparency technologies, such as delaminating coatings, material incompatibility, compromised conductivity, inadequate charge dissipation, and inadequate electromagnetic interference shielding, which contribute to increased mission risk and can lead to catastrophic failure. The primary innovation of the current proposal focuses on applying the Innlay surface-embedding technology to embed aircraft transparencies with inherently built-in electrical conductivity, while retaining the transparency's robustness, providing a superior aircraft transparency material. The material enhancement can be tuned for specific levels of transparency and conductivity to meet various military specifications. This approach fundamentally departs from conventional approaches, such as sputtering secondary layers of conductive metal oxide coatings that can embrittle, corrode, crack, delaminate, and degrade.

* Information listed above is at the time of submission. *

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