Wafer-level Short Wave Infrared (SWIR) Micro-Camera

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: W911QX-13-C-0009
Agency Tracking Number: D2-1178
Amount: $999,994.00
Phase: Phase II
Program: SBIR
Awards Year: 2012
Solicitation Year: 2011
Solicitation Topic Code: SB113-002
Solicitation Number: 2011.3
Small Business Information
590 Territorial Drive, Suite H, Bolingbrook, IL, -
DUNS: 968903422
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Christopher Anton
 (630) 226-0080
Business Contact
 Christoph Grein
Title: Cheif Scientific Officer
Phone: (630) 226-0086
Email: cgrein@episensors.us
Research Institution
This proposed effort focuses on the development and demonstration of an extended short wavelength infrared (eSWIR) micro-camera that is capable of identifying targets at ranges of 100 to 1000 meters with a 40 degree field of view, through a collaborative effort between the proposing small business Episensors, Inc., BAE Systems and Digital Design Corporation. Innovative materials and device processing methods were modeled in Phase I, and indicate that HgCdTe detector arrays can be employed to improve performance over conventional InGaAs-based systems while simultaneously reducing the array cost. By utilizing HgCdTe arrays, the camera system developed in this effort will be able to image out to 2.5 micron wavelength, while InGaAs arrays are unable to image efficiently above 1.7 micron. This will allow the system to collect additional signal from nightglow and facilitate covert communications and tracking in the 1.7 to 2.5 micron range, improving its performance and functionality. Camera costs will further be reduced by utilizing innovative component integration and moldable optics manufacturing, with a targeted reduction in cost of 10x over traditional SWIR camera systems. These integration and manufacturing processes will also allow for a fully integrated camera system size of 20 cm3 to be achieved.

* Information listed above is at the time of submission. *

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