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Embedded Power and Signal Interconnects for Composites (EPIC)

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0147-13-C-7346
Agency Tracking Number: B122-025-0160
Amount: $99,939.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: MDA12-025
Solicitation Number: 2012.2
Timeline
Solicitation Year: 2012
Award Year: 2013
Award Start Date (Proposal Award Date): 2013-01-04
Award End Date (Contract End Date): 2013-07-09
Small Business Information
2780 Skypark Drive Suite 400
Torrance, CA -
United States
DUNS: 106823607
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: Yes
Principal Investigator
 KAREN CHIU
 Principal Investigator
 (310) 626-8360
 kchiu@nextgenaero.com
Business Contact
 Zoltan Feher
Title: Manager, Contracts and Pricing
Phone: (310) 626-8384
Email: zfeher@nextgenaero.com
Research Institution
 Stub
Abstract

The overall objective of this Phase I effort is to demonstrate structural integration of key and critical electrically conductive components, and assess their performance including strain and fatigue capabilities by developing and evaluating multiple concepts. To this end, NextGen will investigate multiple technologies and concepts which will lead to structurally integrated power buses, cables and wiring in a CFRP composite representative of missile structures. NextGen will down-select to a single concept by conducting structural and electrical testing and fabricate a proof-of-concept cylindrical composite article with embedded conductors and first-generation ingress-egress interconnects including intermediate wiring branches. At the end of Phase I, NextGen expects to achieve a TRL = 3-4. Guided by the Phase I design and test results, a potential Phase II effort will further mature the technology by performing a comprehensive set of laboratory and operational tests to achieve a TRL = 6-7. NextGen will also address cost, weight, ease-of-fabrication and reliability issues to facilitate near-term technology transfer.

* Information listed above is at the time of submission. *

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