Biodegradable Amorphous Metal-Oxide Printable Electronics

Award Information
Agency:
Department of Defense
Branch
Defense Advanced Research Projects Agency
Amount:
$99,995.00
Award Year:
2013
Program:
SBIR
Phase:
Phase I
Contract:
W31P4Q-13-C-0140
Award Id:
n/a
Agency Tracking Number:
D131-005-0017
Solicitation Year:
2013
Solicitation Topic Code:
SB131-005
Solicitation Number:
2013.1
Small Business Information
Photonic Systems Division, 1845 West 205th Street, Torrance, CA, -
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
Y
Duns:
153865951
Principal Investigator:
Gary Mikaelian
Director
(310) 320-3088
psproposals@poc.com
Business Contact:
Gordon Drew
Chief Financial Officer
(310) 320-3088
gedrew@poc.com
Research Institute:
n/a
Abstract
To address the DARPA need to develop a set of biodegradable materials and industry-compatible fabrication processes for demonstrating fully biodegradable, biomedical sensor/actuator systems with electronic performance comparable to silicon on insulator (SOI)-based systems, Physical Optics Corporation (POC) proposes to develop a new Biodegradable Amorphous Metal-Oxide Printable Electronics (BioAMP) technology. This proposed technology is based on room temperature printing of amorphous metal oxide sol-gel films directly insulating biodegradable polymer substrates. The innovation in using photochemical activation of metal oxide semiconductor devices will allow for circumvention of the low carrier mobility drawback of the organic electronics, while keeping the advantage of the"benchtop"manufacturing technology. As a result, this technology offers a low-cost solution for developing various biodegradable and implantable electronics that directly address the DARPA requirements. In Phase I, POC will demonstrate the feasibility of BioAMP by conducting a comprehensive theoretical study and performing proof-of-concept experiments. In Phase II, POC plans to build several fully operational biodegradable electronic prototypes that will be tested in simulated environments, thus achieving TRL-5.

* information listed above is at the time of submission.

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