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Large Displaement, Tuned Deck Simulating Fixture for Medium Weight, Shock Isolated Equipment

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N00024-13-P-4528
Agency Tracking Number: N123-158-0100
Amount: $79,612.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N123-158
Solicitation Number: 2012.3
Timeline
Solicitation Year: 2012
Award Year: 2013
Award Start Date (Proposal Award Date): 2013-03-12
Award End Date (Contract End Date): 2013-09-12
Small Business Information
12303 Technology Blvd. Suite 925
Austin, TX -
United States
DUNS: 602414141
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Greg Mooty
 Project Engineer
 (512) 744-1804
 gmooty@aesaustin.com
Business Contact
 Jon Noeth
Title: President
Phone: (512) 744-1801
Email: jnoeth@aesaustin.com
Research Institution
 Stub
Abstract

Ascendant Engineering Solutions (AES) proposes to develop a Large Displacement, Tuned Deck Simulating Fixture for Medium Weight, Shock Isolated Equipment (LTMS) to address the Navy SBIR topic N123-158 - Innovative Approach to Low Cost Shock Testing Fixture for Medium Weight, Shock Isolated Equipment. The AES LTMS concept incorporates a Large Displacement Mechanism (LDM) to provide the large displacements (greater than the 3"MWSM anvil travel) that produce damage to resiliently-mounted equipment, combined with a Deck Simulating Fixture (DSF) tunable to 7, 10, 14, 20, and 28 Hz. AES will complete design trades including linear and nonlinear analyses to develop an optimal configuration that meets the LDM, DSF requirements as well as weight and size / interface constraints of the MWSM. Like the AES"Weapon Shock Simulator used by the US Army, AES proposes to integrate an automated shock measurement, and analysis tool to verify compliance to requirements. AES"s Phase I base and option plan provide a means to quickly develop a prototype in a Phase II program, and AES will work with their network of large defense company partners to rapidly transition this technology to a product.

* Information listed above is at the time of submission. *

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