Conformable Thermal Ground Plane

Award Information
Agency:
Department of Defense
Amount:
$149,897.00
Program:
SBIR
Contract:
HDTRA1-13-P-0008
Solitcitation Year:
2012
Solicitation Number:
2012.2
Branch:
Defense Threat Reduction Agency
Award Year:
2013
Phase:
Phase I
Agency Tracking Number:
T122-002-0142
Solicitation Topic Code:
DTRA122-002
Small Business Information
i2C Solutions, LLC
686 S. Taylor Ave., Suite 108, Louisville, CO, -
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
968561584
Principal Investigator
 Seth Miller
 CTO
 (972) 814-3813
 seth.miller@i2csolutions.com
Business Contact
 Douglas Campbell
Title: President&CEO
Phone: (720) 300-8167
Email: doug.campbell@i2csolutions.com
Research Institution
 Stub
Abstract
Miniaturized smart munitions are seeing increasing use across all branches of the Department of Defense (DoD) in order to meet the ever evolving mission needs for the U.S. warfighter. These smart micromuntions have been enabled by advances in capabilities and miniaturization of critical microelectonic and microelectromechanical systems such as sensor, navigational, communications, and triggering subsystems. Their small size and stringent packaging requirements in an often complex and crowded munitions platform leaves little space for active cooling for required levels of thermal management. As a result, the DoD has considerable interest in the development of advanced thermal management technologies and materials that can better accommodate the thermal budget of existing munitions platforms without the need to redesign the systems. The development of such a technology will provide needed heat transfer margins for electronic devices, reduce the size and mass of the thermal management system and increase munition payload capacity thereby increasing overall system performance and effectiveness. To address this need, i2C Solutions proposes the development of a highly novel thermal ground plane technology that provides considerable thermal conductivity, EMI protection and in a highly ruggedized package.

* information listed above is at the time of submission.

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