Thermal Enhancements for Separable Thermal Mechanical Interfaces

Award Information
Agency:
Department of Defense
Branch
n/a
Amount:
$149,995.00
Award Year:
2013
Program:
SBIR
Phase:
Phase I
Contract:
FA9453-13-M-0077
Award Id:
n/a
Agency Tracking Number:
F131-077-1375
Solicitation Year:
2013
Solicitation Topic Code:
AF131-077
Solicitation Number:
2013.1
Small Business Information
1046 New Holland Avenue, Lancaster, PA, -
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
126288336
Principal Investigator:
JensWeyant
Lead Engineer
(717) 295-6093
Jens.Weyant@1-act.com
Business Contact:
FrankMorales
Accounting Clerk
(717) 295-6092
Frank.Morales@1-act.com
Research Institute:
Stub




Abstract
ABSTRACT: The purpose of the proposed SBIR program is to develop a thermally enhanced, separable thermal mechanical interface (STMI) that aims to significantly enhance heat transfer by providing a direct thermal path from the high power density components to the heat sink. In the current commercial off-the-shelf STMI multiple interfaces significantly increase the thermal resistance resulting in marginal heat transfer. The need for improved thermal performance is required as power densities of electronics increase. The primary objective of Phase I will be to model and develop a functional prototype STMI demonstrating the feasibility and potential thermal performance improvements compared to current state-of-the-art solutions. The thermal performance of the STMI will be enhanced by: (i) increasing the bulk thermal conductance of current state-of-the-art STMI, (ii) reducing the contact resistance by optimizing the clamp design, and (iii) integrating an innovative card lock mechanism to increase the contact area. Advanced Cooling Technologies, Inc. (ACT) will collaborate with Lockheed Martin Corporation (LM), to build upon the internal research and development work separately performed on the STMI by ACT and LM, in order to achieve the Air Force objectives for STMI. BENEFIT: If the Phase II program is successful, ACT will have designed, fabricated, and demonstrated a STMI that is thermally superior to the current state of the art. The thermally enhanced STMI developed in this program will increase the conduction cooling capacity of current, as well as future, electronics systems used in the aerospace, defense, and commercial sectors. ACT has a strong grasp of the customer base due to the synergy between this technology and current product offerings. LM has acquired US Patent No. 0087089 for its cardlock clamp. ACT has also submitted for a patent for an embedded heat pipe cardlock clamp in 2012. Any further developments or combinations will be protected by patents. Depending on the final product outcome, licensing agreements between LM and ACT will be put in place to manufacture and sell this product.

* information listed above is at the time of submission.

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