Chip-Scale Photonics for Wide Temperature and High-Speed Optical Interconnects

Award Information
Agency:
Department of Defense
Branch
Army
Amount:
$99,888.00
Award Year:
2013
Program:
STTR
Phase:
Phase I
Contract:
W911NF-13-C-0024
Agency Tracking Number:
A12A-008-0429
Solicitation Year:
2012
Solicitation Topic Code:
A12a-T008
Solicitation Number:
2012.A
Small Business Information
Ultra Communications Inc
990 Park Center Drive, Suite H, Vista, CA, -
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
199060521
Principal Investigator:
Charlie Kuznia
President
(760) 652-0007
ckuznia@ultracomm-inc.com
Business Contact:
Charlie Kuznia
President
(760) 652-0007
ckuznia@ultracomm-inc.com
Research Institution:
West Virginia High Technology Conso
Brian Lemoff
1000 Technology Drive, Suite 1
Fairmont, WV, 26554-
(304) 333-6442
Federally funded R&D center (FFRDC)
Abstract
This program will create 40 Gbps VCSEL-based micro-transceiver (uTRX) components that operate reliably over the standard military temperature range of -55°C to 125°C in Army environments. uTRXs are low-cost, compact components that can be assembled into the PCB in close proximity to high-performance ASICs using conventional solder-reflow"pick-and-place"assembly. The small PCB footprint and solderability is necessary to achieve high-density and flexible placement of optical components near the data source/sink. By reducing the routing lengths of high-speed copper wiring, we can achieve low-power, EMI-immune links within high-performance military computing and sensor systems.

* information listed above is at the time of submission.

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