Aerosol Jet Printing of Single-Wall Carbon Nanotube Transistors on Plastic Substrate

Award Information
Agency:
Department of Defense
Branch
n/a
Amount:
$749,793.00
Award Year:
2013
Program:
STTR
Phase:
Phase II
Contract:
FA8650-13-C-5172
Award Id:
n/a
Agency Tracking Number:
F09B-T26-0152
Solicitation Year:
2009
Solicitation Topic Code:
AF09-BT26
Solicitation Number:
2009.B
Small Business Information
3911 Singer NE, Albuquerque, NM, -
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
175348549
Principal Investigator:
Michael Renn
Senior Scientist
(651) 641-2850
mrenn@optomec.com
Business Contact:
Dave Keicher
Chief Technology Officer
(505) 761-8250
dkeicher@optomec.com
Research Institute:
University of Minnesota
Pat Jondahl
450 McNamara Alumni Center
200 Oak Street S.E.
Minneapolis, MN, 55455-5455
(612) 626-2244
Nonprofit college or university
Abstract
ABSTRACT: The goal of this phase II proposal is to develop a commercial platform for printing high performance, single-walled carbon nanotube transistor circuits on large-area plastic substrate. Automated processes will be developed for the room temperature printing of metal, semiconductor, and dielectric materials with micron-scale alignment accuracy. The transistor performance will be enhanced by optimizing the material formulations as well as optimizing the print features. Specifically, printed channel widths below 10 microns and gate dielectric thickness below 100 nm are targeted. This will potentially allow frequency performance in the GHz range. Many commercial and defense applications have already identified such as roll-up maps, RF antenna, and distributed sensor networks. The Optomec commercialization plan will leverage off already successful product launches where initially the market was seeded with R & D tools. Sales of production tools followed after a period of qualification and validation. BENEFIT: Example applications include roll-up maps, active matrix displays, sensor networks, arithmetic logic units, and rf antenna. The proposed printing system will be capable of fabricating circuits at low-cost and on large-area substrates.

* information listed above is at the time of submission.

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