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Production of Reduced Defect Density (112) Silicon Wafers Utilizing Ultra- Gentle, Chemical Mechanical Smoothening (CMS) Process

Award Information
Agency: Department of Defense
Branch: Army
Contract: W909MY-13-C-0001
Agency Tracking Number: A2-5099
Amount: $1,049,171.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: A11-030
Solicitation Number: 2011.1
Solicitation Year: 2011
Award Year: 2013
Award Start Date (Proposal Award Date): 2013-02-07
Award End Date (Contract End Date): 2015-06-07
Small Business Information
1912 NW 67th Place
Gainesville, FL -
United States
DUNS: 024935517
HUBZone Owned: No
Woman Owned: Yes
Socially and Economically Disadvantaged: No
Principal Investigator
 Deepika Singh
 (352) 334-7237
Business Contact
 Deepika Singh
Title: President&CEO
Phone: (352) 334-7237
Research Institution

Next generation infra-red focal plane array applications for night vision systems require high quality, large area HgCdTe epi-layers. Such layers are only possible with the use of (112) Si substrates that are of high quality with surfaces that are pristine and devoid of defects. However, commercially available (112) Si surfaces typically have the presence of a large number of COP (crystal originated particle) defects, scratches, and surface defects that lead to the broadening of X-ray rocking curve. This leads to poor crystalline quality. Such defects arise due to CMP (chemical mechanical polishing) processes used by the industry in polishing these wafers. Sinmat has developed a new polishing process that can eliminate COP defects, scratches, and surface contamination. The chemical mechanical smoothening (CMS) processes developed as a part of the Phase I effort, enhance the crystalline quality of (112) Si wafers. As a part of the Phase II effort, Sinmat will further develop and optimize the ultra-smooth and ultra-gentle CMS polishing process. The company will also conduct joint-testing, development and integration studies with end users of (112) Si wafers.

* Information listed above is at the time of submission. *

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