Monolithic S-band Multichannel Transmit/Receive Module for Communication Phased Array Antennas

Award Information
Agency:
Department of Defense
Branch
n/a
Amount:
$739,475.00
Award Year:
2013
Program:
SBIR
Phase:
Phase II
Contract:
FA8650-13-C-1609
Award Id:
n/a
Agency Tracking Number:
F121-159-0514
Solicitation Year:
2012
Solicitation Topic Code:
AF121-159
Solicitation Number:
2012.1
Small Business Information
Two Executive Drive, Suite 305, Chelmsford, MA, -
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
168849011
Principal Investigator:
Cheryl Liss
Principal Engineer
(978) 452-7700
cliss@aurigamicrowave.com
Business Contact:
Moosa Moosa
Chief Financial Officer
(978) 452-7700
mmoosa@aurigamicrowave.com
Research Institution:
Stub




Abstract
ABSTRACT: Phase II tasks will produce a full-duplex, multi-channel, S-band transmit-receive (T/R) module for integration into large communication phased array antennas. An RF section featuring advanced, two-chip Monolithic Microwave Integrated Circuit (MMIC) technology will replace the large number of discrete radio frequency (RF) components in existing systems. An embedded command microcontroller will provide internal protection and built-in test capability as well as serial-to-parallel command conversion. Design of the module will include interconnection and distribution circuits as well as the mechanical and thermal configurations. The anticipated advantages of this approach are size, weight, and cost reductions and maximized manufacturability, reproducibility, flexibility, and ease of replacement. In Phase I, the MMICs were designed to predict performance capability and circuit integration. The module capability will be demonstrated and evaluated in Phase II with prototype fabrication, assembly, and testing. BENEFIT: Auriga"s low-cost, full-duplex T/R module at S-band will drive down size and cost for large phased-array systems. The module will be well-suited for quick adaptation to many systems in the L- to X-band range, requiring multiple concurrent communication links capable of transmitting and receiving multiple beams simultaneously.

* information listed above is at the time of submission.

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