Improved Full Authority Digital Engine Control (FADEC) System
Department of Defense
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Small Business Information
Embedded Systems LLC
22 Salisbury Way, Farmington, CT, 06032
Socially and Economically Disadvantaged:
AbstractThe continuing demand for improving the capabilities of Full Authority Digital Engine Control (FADEC) systems while reducing their size, weight and cooling requirements has led to investigations of alternate architectures and electronic devices for the next generation of advanced propulsion systems. The feasibility of using available Silicon On Insulator (SOI) technology devices that can operate in high temperature environments for the development of intelligent nodes in a distributed architecture FADEC system that does not require cooling has been established. The miniaturization of SOI technology devices into a System On a Chip (SOC) is the essential and next logical step for the transition of this technology into production ready components and building blocks for the benefit of all FADEC system developers and users. The proposed SOC for FADEC is a high temperature capable, modular, scalable and flexible SOI device that can be reconfigured in software and used for implementing an intelligent node for interfacing with most classes of sensors found in FADEC systems. The device can also be scaled up for use in a FADEC computer for interfacing with multiple sensors and actuators. The SOC is therefore the key enabling device for the realization of advanced FADEC systems or aerospace applications with demanding requirements for size, weight and thermal cooling. BENEFIT: The successful development of the high temperature capable SOC solution for FADEC is anticipated to significantly reduce the size, weight and cooling requirement for the next generation of distributed as well as centralized FADEC systems. The flexibility and scalability of the SOC device should lead to significant potential commercial applications in the military, commercial engine and aerospace applications as well as the oil exploration and stationery power markets.
* information listed above is at the time of submission.