Thermal Management Improvements for Transmit/Receive Modules

Award Information
Agency:
Department of Defense
Branch
n/a
Amount:
$80,000.00
Award Year:
2013
Program:
SBIR
Phase:
Phase I
Contract:
N00024-13-P-4560
Award Id:
n/a
Agency Tracking Number:
N131-028-0037
Solicitation Year:
2013
Solicitation Topic Code:
N131-028
Solicitation Number:
2013.1
Small Business Information
PA, Lancaster, PA, 17601-5688
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
126288336
Principal Investigator:
Richard Bonner
Manager, Custom Products
(717) 295-6105
Richard.Bonner@1-act.com
Business Contact:
Frank Morales
Accounting Clerk
(717) 295-6092
Frank.Morales@1-act.com
Research Institution:
Stub




Abstract
This Small Business Innovation Research (SBIR) Phase I project will develop and demonstrate a thermal ground plane (TGP) technology with improved manufacturability and reliability over previous technology generations. Advanced Cooling Technologies, Inc. is developing ultra low thermal resistance and high heat flux wick structures to improve thermal performance in TGP's used to cool electronic systems. The advanced TGP's further consist of ceramic materials with coefficients thermal of expansion (CTE's) closely matching those common semiconductor materials. The CTE matching feature allows the TGP to be soldered directly to the semiconductor device using standard manufacturing practices, which helps to minimize the thermal interface resistance between the TGP and the semiconductor device.

* information listed above is at the time of submission.

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