Thermal Management Improvements for Transmit/Receive Modules

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$79,942.00
Award Year:
2013
Program:
SBIR
Phase:
Phase I
Contract:
N00024-13-P-4562
Award Id:
n/a
Agency Tracking Number:
N131-028-0401
Solicitation Year:
2013
Solicitation Topic Code:
N131-028
Solicitation Number:
2013.1
Small Business Information
1000 A Pannell Street, Columbia, MO, -
Hubzone Owned:
Y
Minority Owned:
N
Woman Owned:
N
Duns:
808369792
Principal Investigator:
Aaron Hathaway
Thermal Engineer
(773) 355-1653
aaron.hathaway@thermavant.com
Business Contact:
Joe Boswell
President
(415) 264-0668
joe.boswell@thermavant.com
Research Institution:
n/a
Abstract
An oscillating heat pipe (OHP) embedded substrate made from low coefficient of thermal expansion (CTE) material(s) will be designed, simulated, optimized, fabricated, and empirically tested to demonstrate the OHP technology's ultra-high heat transfer rates under real-world microchip operating conditions as found in shipboard Transmit/Receive modules. With guidance from a large supplier of Naval radar systems, ThermAvant will prototype OHP-based cooling solutions that can be directly attached to GaN, Si or SiC microchips without the thermal/mechanical stresses induced by traditional thermal management materials"CTE mismatch with such chips. Phase I and Phase I Option (if awarded) research efforts will focus not only on optimizing thermal performance but also on developing a form factor and manufacturing process(es) that can be easily integrated into current products and assembly flows utilized by T/R Module manufacturers.

* information listed above is at the time of submission.

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