Thermal Management Improvements for Transmit/Receive Modules
Small Business Information
1000 A Pannell Street, Columbia, MO, -
AbstractAn oscillating heat pipe (OHP) embedded substrate made from low coefficient of thermal expansion (CTE) material(s) will be designed, simulated, optimized, fabricated, and empirically tested to demonstrate the OHP technology's ultra-high heat transfer rates under real-world microchip operating conditions as found in shipboard Transmit/Receive modules. With guidance from a large supplier of Naval radar systems, ThermAvant will prototype OHP-based cooling solutions that can be directly attached to GaN, Si or SiC microchips without the thermal/mechanical stresses induced by traditional thermal management materials"CTE mismatch with such chips. Phase I and Phase I Option (if awarded) research efforts will focus not only on optimizing thermal performance but also on developing a form factor and manufacturing process(es) that can be easily integrated into current products and assembly flows utilized by T/R Module manufacturers.
* information listed above is at the time of submission.