Electromagnetic-Attack-Resistant EO Polymer/Sol-gel Modulator

Award Information
Agency:
Department of Defense
Branch
n/a
Amount:
$80,000.00
Award Year:
2013
Program:
SBIR
Phase:
Phase I
Contract:
N00014-13-P-1110
Award Id:
n/a
Agency Tracking Number:
N131-066-0018
Solicitation Year:
2013
Solicitation Topic Code:
N131-066
Solicitation Number:
2013.1
Small Business Information
1430 N. 6th Ave., Tucson, AZ, -
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
601990778
Principal Investigator:
Arkady Bablumyan
Optical Engineer
(760) 722-0572
bablumyan@tipdllc.com
Business Contact:
James Fountain
Business Manager
(520) 250-4405
fountain@tipdllc.com
Research Institution:
Stub




Abstract
RF photonic links provide an attractive approach to minimizing the impact of an electromagnetic attack on defense and commercial communications infrastructure. A key component in an RF photonic link is an electro-optic (EO) modulator, and current commercially available EO modulators are not able to withstand the 10kW peak power pulses that can results from an electromagnetic attack, such as an electromagnetic pulse (EMP). In the proposed program, TIPD, LLC will develop design concepts and materials candidates for a novel EMP-hard modulator based on its proven EO polymer/sol-gel modulator platform, which has achieved low drive voltages (~ few volts), low insertion loss (~ 5dB or less) and high speed operation suitable for RF photonics links. The EMP-hard properties of the modulator will derive from the unique, dielectric breakdown suppression properties of TIPD"s sol-gel materials, which have been used in high dielectric breakdown strength applications like claddings for EO polymer modulators and high energy storage density capacitors. The Phase I program will comprise modulator design, materials selection, electrical/thermal modeling, and high frequency/high voltage materials characterization, while the Phase I Option will include prototype phase modulator development and roadmapping the testing needs of Phase II.

* information listed above is at the time of submission.

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