Next-Generation Micro-chip Carrier for Cooling of Satellite Payload Electronics

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA9453-13-C-0029
Agency Tracking Number: F112-057-1506
Amount: $742,600.00
Phase: Phase II
Program: SBIR
Awards Year: 2013
Solicitation Year: 2011
Solicitation Topic Code: AF112-057
Solicitation Number: 2011.2
Small Business Information
1000 A Pannell Street, Columbia, MO, -
DUNS: 808369792
HUBZone Owned: Y
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Peng Cheng
 Senior Thermal Engineer
 (888) 415-7306
 peng.cheng@thermavant.com
Business Contact
 Joe Boswell
Title: President
Phone: (888) 415-7306
Email: joe.boswell@thermavant.com
Research Institution
 Stub
Abstract
ABSTRACT: A chip carrier for high power density electronics made from low CTE materials and embedded with an oscillating heat pipe will be applied to a real world satellite electronics device to transform high heat flux (e.g. 100-300W/cm2) at the device package to a lower heat flux at the heat sink areas - and do so with minimal thermal resistance. Deliverables at conclusion of two-year effort will include a demonstration OHP-based chip carrier prototype attached to simulated real chip(s) on test board with integrated heat sink. BENEFIT: The expected benefit of this proposed Phase II effort is the deployment of higher power processors aboard satellite payloads. Such an enabling technology will be applicable commercial and military satellite applications, as well as terrestrial ones with ultra-high heat flux and/or constrained heat rejection rates.

* Information listed above is at the time of submission. *

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