Next-Generation Micro-chip Carrier for Cooling of Satellite Payload Electronics

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$742,600.00
Award Year:
2014
Program:
SBIR
Phase:
Phase II
Contract:
FA9453-13-C-0029
Award Id:
n/a
Agency Tracking Number:
F112-057-1506
Solicitation Year:
2011
Solicitation Topic Code:
AF112-057
Solicitation Number:
2011.2
Small Business Information
1000 A Pannell Street, Columbia, MO, -
Hubzone Owned:
Y
Minority Owned:
N
Woman Owned:
N
Duns:
808369792
Principal Investigator:
Peng Cheng
Senior Thermal Engineer
(888) 415-7306
peng.cheng@thermavant.com
Business Contact:
Joe Boswell
President
(888) 415-7306
joe.boswell@thermavant.com
Research Institution:
Stub




Abstract
ABSTRACT: A chip carrier for high power density electronics made from low CTE materials and embedded with an oscillating heat pipe will be applied to a real world satellite electronics device to transform high heat flux (e.g. 100-300W/cm2) at the device package to a lower heat flux at the heat sink areas - and do so with minimal thermal resistance. Deliverables at conclusion of two-year effort will include a demonstration OHP-based chip carrier prototype attached to simulated real chip(s) on test board with integrated heat sink. BENEFIT: The expected benefit of this proposed Phase II effort is the deployment of higher power processors aboard satellite payloads. Such an enabling technology will be applicable commercial and military satellite applications, as well as terrestrial ones with ultra-high heat flux and/or constrained heat rejection rates.

* information listed above is at the time of submission.

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