Lightweight Structural Materials for Broadband Electromagnetic Hardening
Department of Defense
Agency Tracking Number:
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Small Business Information
Conductive Composites Company
357 West 910 South, Heber City, UT, -
Socially and Economically Disadvantaged:
Founder and CTO
Founder and CTO
AbstractABSTRACT: Conductive Composites has developed lightweight materials that provide high levels of conductivity and electromagnetic (EM) shielding for composite and advanced polymer materials systems. Conductive materials include metal coated carbon fibers and nonwovens, along with nickel nanostrands. The performance capabilities of the materials have now been extended and tested to include broadband frequency capabilities and protection in high-altitude electromagnetic pulse (HEMP) environments. The proposed work shall build on the successes of the Phase I effort and continue in developing lightweight composites structures for broadband electromagnetic hardening. These next steps will include investigating the format and mass fraction of each shielding constituent in a composite, alternative composite fabrication processes, and the ability to custom fit the construction of the composite to meet specific shielding requirements. New constituent materials are proposed to improve shielding performance for high energy particles. Furthermore, Conductive Composites will work closely with suppliers and the Air Force Intellectual Property Office to ensure that the technology is adequately defined, licensed, and protected. Composite panels and tubes will be fabricated, tested for electromagnetic shielding, and delivered to AFRL/AFIT for further testing. BENEFIT: Lightweight broadband shielding conductive composite systems can replace heavy metallic structures while still providing electromagnetic shielding. Weight savings can be as much as 75%. The ability to fabricate composites structures that meet the shielding requirements of demanding environments enables a new field for manufacturing lightweight shielded structures.
* information listed above is at the time of submission.