Company Information
GRANGER, IN, 46530-8231


DUNS: 831862227

# of Employees: 3

Ownership Information

HUBZone Owned: N

Socially and Economically Disadvantaged: N

Woman Owned: N

Award Charts

Award Listing

  1. Enabling Large Format Deep Pixel Detectors Through 3D Quilt Packaging

    Amount: $149,975.81

    This proposal would develop the next generation of interconnects and assembly technology by making use of Quilt Packing® (QP) interconnects for the integration of semiconductor chips to extend system ...

    SBIRPhase I2017Department of Energy
  2. Heterogeneous Chip Integration for GHz Systems

    Amount: $124,869.00

    Indiana Integrated Circuits, LLC (IIC) proposes to develop the customizable, high-performance microchip interconnect technology called Quilt Packaging (QP) to address NASA's requirement for high perfo ...

    SBIRPhase I2014National Aeronautics and Space Administration
  3. Advanced Chip Integration for Enhanced Arrays

    Amount: $149,757.00

    ABSTRACT: Improvements such as increased array size and better non-uniformity correction have been made to resistive emitter arrays fabricated on silicon (Si). There exist additonal wavelengths of in ...

    SBIRPhase I2013Air Force Department of Defense

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