Electromagnetic Hardened Composite Electronics Enclosures

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8650-13-M-5043
Agency Tracking Number: F131-110-2419
Amount: $149,790.00
Phase: Phase I
Program: SBIR
Awards Year: 2013
Solicitation Year: 2013
Solicitation Topic Code: AF131-110
Solicitation Number: 2013.1
Small Business Information
Conductive Composites Company
357 West 910 South, Heber City, UT, -
DUNS: 150393569
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 George Hansen
 Founder and CTO
 (435) 654-3683
 gchansen@conductivecomposites.com
Business Contact
 Nathan Hansen
Title: President
Phone: (435) 654-3683
Email: ndhansen@conductivecomposites.com
Research Institution
N/A
Abstract
ABSTRACT: Traditional shielding enclosures are fabricated from heavy metallic materials. Polymer and composite systems have been used extensively in enclosures for due to their significant weight and manufacturing advantages, but have not been able to provide adequate levels of electromagnetic shielding. Conductive composite materials will be used to fabricate and test composite enclosures that provide the weight and manufacturing advantages of polymer based systems while also providing required levels of electromagnetic shielding. The proposed conductive composite material systems have been proven in fabricating composites by standard manufacturing processes that match the shielding effectiveness of metallic structures, at less than half the weight. The proposed solution is affordable, corrosion immune, and transitionable to the field and also to similar platforms/applications. All proposed components are available from commercial domestic sources. An enclosure that is approximately 12x24x6 inches in size will be fabricated, tested for electromagnetic shielding effectiveness, and delivered. BENEFIT: Lightweight conductive composite cases can provide 50-75% weight savings over metallic cases while still meeting shielding requirements.

* information listed above is at the time of submission.

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