Low Filler-concentration Advanced Thermal Management Materials for Power Systems Components

Award Information
Department of Defense
Award Year:
Phase I
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Solicitation Year:
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Small Business Information
ADA Technologies, Inc.
8100 Shaffer Parkway, Suite #130, Littleton, CO, -
Hubzone Owned:
Minority Owned:
Woman Owned:
Principal Investigator:
Sayangdev Naha
Research Engineer
(303) 792-5615
Business Contact:
James Budimlya
(303) 792-5615
Research Institution:
ABSTRACT: The stable and reliable operation of megawatt-class, high-temperature power electronics is critical for military aircraft operations. In particular, military aircraft emphasize mission capability as one of the primary objectives, thereby making reliability of power systems components one of the most essential design parameters. Specifically, fifth-general military aircraft such as F-22 and F-35 employ state-of-the-art avionics, environmental control systems and electrical actuation systems requiring up to five times the heat load over fourth-generation platforms such as F-15 and F-16. As such, new thermal greases are required that offer thermal resistances that are factors lower, exhibit increased mechanical compliance due to thermal expansion coefficients, and possess robust thermal performance over severe temperature cycles. It is also highly desirable that these materials offer facile reworking/reapplication, can be manufactured according to existing methods and are highly scalable. To address this need, ADA Technologies, Inc. proposes the development of uniquely treated nanomaterials dispersed in a polymer matrix that offer substantially decreased thermal resistance through improved energy transfer in relevant configurations. ADA"s proposed approach will lead to ultrahigh performance TIMs that will lead to cooling by>30°C for a heat flux of 100 W/cm2 over a temperature range of -55°C to 200°C. BENEFIT: ADA"s proposed TIM technology holds immense potential in providing an excellent interface for heat transfer between high energy output components such as power electronics modules and corresponding heat spreaders. Our approach is applicable to any polymer system and maintains the highly desirable properties of polymers including low density, ease of manufacturing into various shapes and form factors, and low cost. These benefits permit introduction of this technology into a wide range of AF interests such as military aircraft, directed energy systems, satellites, and avionics. Further, this technology will have direct benefits in many commercial electronics including personal electronics, civilian aircraft and other microelectronics. Other intended commercial and military applications that will benefit from this technology include telecommunication relay stations, data farms, computing centers and transmit/receive modules that are prevalent on Navy ships, aircraft and communications systems.

* information listed above is at the time of submission.

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