High Thermal Performance Gallium Nitride Power Amplifier and Transmit/Receive Module Packaging

Award Information
Agency:
Department of Defense
Branch
n/a
Amount:
$749,966.00
Award Year:
2013
Program:
SBIR
Phase:
Phase II
Contract:
N00024-13-C-4519
Award Id:
n/a
Agency Tracking Number:
N111-034-0186
Solicitation Year:
2011
Solicitation Topic Code:
N111-034
Solicitation Number:
2011.1
Small Business Information
3495 Kent Avenue, Suite M100, West Lafayette, IN, -
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
141450135
Principal Investigator:
JacobSmelser
President
(765) 775-1011
jsmelser@omegamicrotech.com
Business Contact:
JacobSmelser
President
(765) 775-1011
jsmelser@omegamicrotech.com
Research Institute:
n/a
Abstract
The development of Wide Bandgap Semiconductors such as GaN has enabled tremendous improvements in power amplifier performance such as operational frequency and output power. These device improvements have in turn enabled performance and capability improvements in the end applications such as EW systems and radar T/R modules. The advances in device technology have not come without their own set of limitations which must yet be overcome. One issue that plagues equipment designers is the need for improved thermal efficiency which is exacerbated by the continuing requirement for smaller equipment footprints combined with increased functionality. While the development of ceramic multi-layer technologies has allowed smaller footprints to be realized through embedded circuitry and denser packaging, the thermal conductivity of such packages has not kept pace with the device technology itself. With the increased power densities expected from newer device technologies, an improved and advanced multi-layer packaging technology is being developed which takes into account the substrate materials and processing, the heat spreader material and attachment method, the final package into which the modules are mounted, newer devices and attachment materials, and the manufacturing and assembly processes in order to yield a high performance, thermally efficient, cost effective packaging solution.

* information listed above is at the time of submission.

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