A Conformal Packaging and Installation Technique for In Situ Sensors in Extreme Environments

Award Information
Agency:
Department of Defense
Branch:
Navy
Amount:
$579,937.00
Award Year:
2013
Program:
SBIR
Phase:
Phase II
Contract:
N68335-13-C-0159
Agency Tracking Number:
N112-123-0584
Solicitation Year:
2011
Solicitation Topic Code:
N112-123
Solicitation Number:
2011.2
Small Business Information
Sporian Microsystems, Inc.
515 Courtney Way Suite B, Lafayette, CO, -
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
128688111
Principal Investigator
 Yiping Liu
 Scientist
 (303) 516-9075
 yliu@sporian.com
Business Contact
 Michael Usrey
Title: VP of Business Developmen
Phone: (303) 516-9075
Email: musrey@sporian.com
Research Institution
N/A
Abstract
Sporian Microsystems Inc. has spent the last several years developing polymer derived SiCN sensor and associated packaging technology for application temperatures up to 1350 & #176;C, and demonstrated them in the combustion environments of a range of commercial burner rigs and aerospace turbine engines. Based on our expertise in high-temperature materials and packaging processes, we propose to develop a conformal packaging and"stick on"installation strategy for high temperature conformal sensors. The Phase I effort primarily included: working with turbine engine OEMS to define applications, the development of key fabrication processes, and proof of principle demonstrations. Simple proof of principle packaging prototypes, demonstrating all key process steps, were installed on non-planar surfaces and key aspects of the performance up to 600 & #176;C were demonstrated. The ultimate goal of this proposed Phase II effort is to develop a genetic/standardized high-temperature conformal packaging and installation technology for use in extreme aerospace environments: including temperatures ranging from -60 & #176;C up to 1000 & #176;C, and high-g accelerations. Ultimately, such packaging should be easily installed with no permanent changes to the engine components or surfaces, and sufficiently small and conformal to avoid disrupting aerodynamic flows. The packaging should be widely adaptable for many conformal sensor technologies with future development effort.

* information listed above is at the time of submission.

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