Conformal Thermal Ground Plane for Fiber Amplifier

Award Information
Agency:
Department of Defense
Branch:
Air Force
Amount:
$149,813.00
Award Year:
2013
Program:
SBIR
Phase:
Phase I
Contract:
FA9451-13-M-0339
Agency Tracking Number:
F131-013-1510
Solicitation Year:
2013
Solicitation Topic Code:
AF131-013
Solicitation Number:
2013.1
Small Business Information
i2C Solutions, LLC
686 S. Taylor Ave., Suite 108, Louisville, CO, -
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
968561584
Principal Investigator
 Michael Hulse
 Senior Engineer
 (720) 289-7381
 mike.hulse@i2csolutions.com
Business Contact
 Douglas Campbell
Title: President&CEO
Phone: (720) 300-8167
Email: doug.campbell@i2csolutions.com
Research Institution
N/A
Abstract
ABSTRACT: In response to the U.S. Air Force"s need for fiber cooling and pointing in high power fiber amplifiers of 1kW and up, i2C Solutions propose the development of a conformal thermal ground plane (TGP) technology to interface with heat sinks integrated into the active precision pointing fiber support structure. The result is a highly efficient thermal management solution, with respect to both volume and thermal performance, that is seamlessly integrated with precision pointing capability. Ultimately, the successful implementation of the developed technology will enable the use of revolutionary next-generation airborne laser weapons systems and allow the US Air Force to maintain future air superiority. BENEFIT: If successful, the proposed thermal ground plane technology will allow for higher performing and more reliable high power fiber amplifiers. Beyond the proposed fiber amplifier, the proposed conformal TGP technology could be applied as an improved thermal management system to a broad array of high power electronic systems. Military applications could include unmanned aircraft systems, manned aircraft and directed energy weapon systems among numerous others. Commercial applications could include consumer electronics (e.g., cell phones and laptop computers).

* information listed above is at the time of submission.

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