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Ultra-Low-Noise Short-Wave Infrared (SWIR) Band Hybrid-Integrated Laser
Title: C.E.O.
Phone: (443) 745-4779
Email: pmorton@mortonphotonics.com
Title: C.O.O.
Phone: (410) 707-0949
Email: jill.morton@mortonphotonics.com
ABSTRACT: In this program Morton Photonics will develop an Ultra-Low-Noise (ULN) Short Wave Infrared (SWIR) Hybrid Integrated Laser with low cost, size, weight and power (CSWAP) for operation between 1900nm and 2200nm. The ULN-SWIR laser is based on the hybrid-integration of a high-power SWIR semiconductor gain chip and fiber Bragg grating (FBG) in a novel cavity arrangement. The program will focus on developing the required SWIR sub-components to produce a laser with very narrow linewidth and low Relative Intensity Noise (RIN), similar to previous devices developed by Morton Photonics at telecom wavelengths (1300nm and 1550nm). A second major focus will be in producing the hybrid-integrated laser with high output power,>100mW, in a polarization maintaining singlemode output fiber, through optimization of the SWIR gain chip, FBG and laser cavity design, and laser packaging. BENEFIT: Commercial ULN-SWIR lasers developed in this SBIR program will find major markets in DoD and commercial applications, including Laser Radar (LADAR / LIDAR) systems, spectral sensing (e.g. pollution sensing), and free space communications. The low cost, size, weight and power (CSWAP) of these devices, coupled with their high performance, are major advantages over existing SWIR lasers, including both fiber and solid state versions of Thulium and Holmium based lasers. The low CSWAP will also enable an expansion of these applications and markets by supporting lower overall system size and cost. Beyond the initial goal application, the device will find usage in both DoD and commercial markets in a range of different sensing systems, plus a potentially large market in free-space optical communication systems, taking advantage of the low linewidth and RIN of the laser source to support advanced modulation formats.
* Information listed above is at the time of submission. *