In-Plane Conductivity Improvement to Fiber Reinforced Composite Materials (MSC P4146)

Award Information
Agency: Department of Defense
Branch: Army
Contract: W31P4Q-14-C-0021
Agency Tracking Number: A132-070-0546
Amount: $99,990.00
Phase: Phase I
Program: SBIR
Awards Year: 2014
Solicitation Year: 2013
Solicitation Topic Code: A13-070
Solicitation Number: 2013.2
Small Business Information
Materials Sciences Corporation
135 Rock Road, Horsham, PA, 19044-
DUNS: 075537910
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Simon Chung
 Senior Engineer
 (215) 542-8400
 simon@materials-sciences.com
Business Contact
 Thomas Cassin
Title: President and CEO
Phone: (215) 542-8400
Email: cassin@materials-sciences.com
Research Institution
N/A
Abstract
Missile modernization and future missile designs are utilizing more sophisticated and higher powered electronics in the pursuit of extended missile range, improved accuracy and precision targeting for striking enemy threats. Tight packaging and sophistication of these electronic systems can generate significant heat loads, which needs to be dissipated efficiently in order to maintain functionality and survivability. This program proposes to develop a cost-effective composite airframe with integrated, interlaminar heat spreaders that will provide high in-plane conductivity for thermal management without structural degradation. To seek a balance among cost, thermal capabilities, and structural properties, the program will perform trade studies among commercially available heat spreaders (e.g., flexible graphite sheets currently being employed in cell phone and laptop industry) as well as explore hybrid pitch-pan fabrics, spread tow carbon nanotube composite sheets, and metalized coated carbon fabrics. In addition to material evaluation, this program will evaluate design and processing methodologies to efficiently integrate the heat spreader into airframe type composite structures with minimal retrofitting of current fabrication procedures (e.g., filament winding). This research will directly support the Army"s need for improved thermal management to protect high value, sensitive guidance and control electronics.

* information listed above is at the time of submission.

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