Gallium Nitride Based Active Electronically Scanned Array (AESA) Technology for High Altitude Periscope Detection

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$79,928.00
Award Year:
2014
Program:
SBIR
Phase:
Phase I
Contract:
N68335-14-C-0006
Award Id:
n/a
Agency Tracking Number:
N132-095-0064
Solicitation Year:
2013
Solicitation Topic Code:
N132-095
Solicitation Number:
2013.2
Small Business Information
1 Park Drive, Unit 12, Westford, MA, -
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
625207472
Principal Investigator:
Paul Blount
President
(978) 467-4290
paulb@custommmic.com
Business Contact:
Paul Blount
President
(978) 467-4290
paulb@custommmic.com
Research Institution:
Stub




Abstract
In this proposal, we consider GaN Monolithic Microwave Integrated Circuit (MMIC) Technologies to enable a low cost, high performance, thin, efficient, low size, weight and power (SWaP), Active Electronically Scanned Array (AESA) Radar for high altitude submarine periscope detection. MMIC technology combines and integrates AESA functions into smaller footprints when compared to using separate package parts for each function. MMICs to be developed include single integrated Gallium Nitride (GaN) transmit and receive (T/R) modules that reside on the array face. This technology will lead to efficient and effective introduction of high altitude Anti-Submarine Warfare (ASW) capability into the MQ-8 (B & C) Fire Scout maritime Intelligence, Surveillance, and Reconnaissance (ISR) mission. Developed under the contract will be GaN power amplifiers, switches, and low noise amplifiers. We will also perform a foundry analysis to determine the best GaN process for performance, cost, and reliability. Decision will also be made on whether a single multi-function MMIC or a multi-MMIC package will generate the best combination of performance and versatility, especially when upgrading single sections. Finally the package itself will be re-engineered for a new design that combines exceptional RF performance with optimal heat removal.

* information listed above is at the time of submission.

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