Compact, Lossless, Ruggedized, Electromagnetically Shielded Connectors for Power and Signals

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$80,000.00
Award Year:
2014
Program:
SBIR
Phase:
Phase I
Contract:
N00014-14-P-1072
Award Id:
n/a
Agency Tracking Number:
N132-127-0567
Solicitation Year:
2013
Solicitation Topic Code:
N132-127
Solicitation Number:
2013.2
Small Business Information
64 Jackson Road, Devens, MA, 01434-
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
185904497
Principal Investigator:
HankValcour
Senior Technical Staff
(978) 842-3517
hvalcour@amsc.com
Business Contact:
JamesMaguire
SVP, Global Operations
(978) 842-3036
jmaguire@amsc.com
Research Institute:
n/a
Abstract
Today"s Navy continues to see increased demand for more power both on and off the ship. This need is largely driven by the continued development of high power density advanced weapons systems and sensors. Continued space and weight limitations for these ship applications will drive the need for new power solutions to be light and compact, easing installation on new ships and enabling upgrades on existing ones. To meet this need, highly efficient methods of transferring large amounts of power are being investigated by NSWC Carderock in Philadelphia through the use of High temperature Superconductors (HTS). Although the team in Philadelphia is developing these high capacity, compact power cables, there is no active development for the connectors that these extremely power dense cables will need if they are to integrated at the ship level. American Superconductor Corporation (AMSC) has gained experience in the development, design and manufacture of low voltage DC HTS cable connectors through its partnership with NSWC on the HTS advanced degaussing program. Although high capacity AC power cable connectors will be dramatically different than their low voltage DC counterparts, AMSC is nonetheless uniquely positioned to successfully develop this type of low temperature, thermally isolated, electrical connection.

* information listed above is at the time of submission.

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