High Thermal Conductivity Gaskets Based On Carbon Nanotube Vertical Arrays

Award Information
Agency:
Department of Defense
Branch
n/a
Amount:
$749,487.00
Award Year:
2013
Program:
SBIR
Phase:
Phase II
Contract:
FA9453-13-C-0099
Award Id:
n/a
Agency Tracking Number:
F121-060-0315
Solicitation Year:
2012
Solicitation Topic Code:
AF121-060
Solicitation Number:
2012.1
Small Business Information
409 W. Maple St., Yadkinville, NC, -
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
041336913
Principal Investigator:
Thomas Tiano
Principal Investigator
(978) 846-0377
ttiano@nanotechlabs.com
Business Contact:
Richard Czerw
CEO
(336) 403-7762
czerwr@nanotechlabs.com
Research Institute:
Stub




Abstract
ABSTRACT: Through the Phase II program, NTL will finalize the materials development and demonstrate the ability of a TIM material based on carbon nanotube vertical arrays to meet general requirements for space applications. In addition we will define and initiate tests required for a specific Air Force application. NTL will not only demonstrate a heat transfer coefficient greater than 45,000 W/m2K over an area of 2.5"x 3.0"(thermal conductivity of ~23 W/mk at a thickness of 500 microns), it will demonstrate the capability of operation over a temperature range of -40C to 125C along with 30,000 thermal cycles with a temperature difference of 15C per cycle as well as showing that the thermal conductivity will not be impacted by environmental conditions. BENEFIT: TIMs have wide usage in many other market segments. Due to the high performance of the product, our initial market is space and aerospace applications with the customer base being the Air Force and its prime contractors. The product however will significantly improve the performance of high-power electronic devices, allowing them to continue to increase in power without the threat of overheating. Therefore, the product will make in-roads in to the following technologies: computers, telecoms, medical/office equipment and automotive.

* information listed above is at the time of submission.

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