High Voltage High Frequency SiC Switch

Award Information
Agency:
Department of Defense
Branch
n/a
Amount:
$599,983.00
Award Year:
2010
Program:
SBIR
Phase:
Phase II
Contract:
N00014-10-C-0104
Award Id:
87384
Agency Tracking Number:
N073-197-0610
Solicitation Year:
2007
Solicitation Topic Code:
N07-197
Solicitation Number:
2007.3
Small Business Information
43670 Trade Center Place, Suite 155, Dulles, VA, -
Hubzone Owned:
N
Minority Owned:
Y
Woman Owned:
N
Duns:
148969137
Principal Investigator:
Ranbir Singh
President
(703) 996-8200
ranbir.singh@genesicsemi.com
Business Contact:
Ranbir Singh
President
(703) 996-8200
ranbir.singh@genesicsemi.com
Research Institute:
n/a
Abstract
The stringent power quality, size weight and volume requirements for operating next-generation intelligent power systems (NGIPS) require the development of revolutionary new semiconductor switch technology. The challenging specifications (>20 kHz,>10 kV) demanded by these applications are enabled by fully exploiting the superior electrical and thermal properties of the emerging power semiconductor material of choice: Silicon Carbide. In the Phase I, an innovative SiC device invented recently the SuperJFET, was found to offer the best solution. Extensive analytical and 2D device simulations were conducted to accurately model SiC SuperJFET devices and its performance was verified. Test structures were fabricated to demonstrate critical fabrication steps that enable the realization of high performance SiC devices. Power modules were designed and fabricated that allows reliable packaging and testing of SiC devices. In this Phase II SBIR program, four batches of SiC SuperJFET devices will be designed and fabricated with successively increasing power levels to meet the program objectives. A high volume Silicon Carbide foundry will allow economical production of SuperJFET devices for successful commercialization with DoD prime contractors with high power conditioning systems expertise. A comprehensive military standards test plan will be implemented to enable a successful insertion into SSPS hardware.

* information listed above is at the time of submission.

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