Prognostic Integrated Multi-Sensor MEMS Module (PRISM)

Award Information
Agency:
Department of Defense
Amount:
$148,866.00
Program:
SBIR
Contract:
N68335-10-C-0007
Solitcitation Year:
2009
Solicitation Number:
2009.2
Branch:
Navy
Award Year:
2010
Phase:
Phase I
Agency Tracking Number:
N092-100-0346
Solicitation Topic Code:
N092-100
Small Business Information
Impact Technologies, LLC
200 Canal View Blvd, Rochester, NY, 14623
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
073955507
Principal Investigator
 Carl Palmer
 Manger, Sensing and Monit
 (585) 424-1990
 carl.palmer@impact-tek.com
Business Contact
 Mark Redding
Title: President
Phone: (585) 424-1990
Email: mark.redding@impact-tek.com
Research Institution
N/A
Abstract
Impact Technologies, in cooperation with the MicroElectronics Department at the Rochester Institute of Technology, proposes to create a single-chip MEMS multi-sensor device capable of collecting comprehensive prognostic data. By integrating many of the sensing elements required for effective prognostic life estimation within a single tiny device, the invasiveness and expense associated with implementing condition-based maintenance practices can be dramatically reduced. The proposed MEMS-based module will record temperature, humidity, vibration/shock and stress/strain data for processing via prognostic algorithms. Key tasks of this Phase I effort include: - Design and Integration of multiple MEMS sensing elements operating in close proximity aboard a single silicon chip. - Development of signal conditioning circuitry tailored for driving and recording data from the prognostic MEMS sensing system. - Optimizing power usage based on data sampling rate and duration required for each specific application. - Creating an overall package design that encompasses the sensor, electronics, and communications in form factor that can be noninvasively deployed aboard most platforms. In phase I, a prototype MEMS sensor will be fabricated and parameter sensing will be verified. This provides the groundwork for the development of a deployable, near-final-scale prototype module in Phase II.

* information listed above is at the time of submission.

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