Prognostic Integrated Multi-Sensor MEMS Module (PRISM)

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N68335-10-C-0007
Agency Tracking Number: N092-100-0346
Amount: $148,866.00
Phase: Phase I
Program: SBIR
Awards Year: 2010
Solicitation Year: 2009
Solicitation Topic Code: N092-100
Solicitation Number: 2009.2
Small Business Information
200 Canal View Blvd, Rochester, NY, 14623
DUNS: 073955507
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Carl Palmer
 Manger, Sensing and Monit
 (585) 424-1990
Business Contact
 Mark Redding
Title: President
Phone: (585) 424-1990
Research Institution
Impact Technologies, in cooperation with the MicroElectronics Department at the Rochester Institute of Technology, proposes to create a single-chip MEMS multi-sensor device capable of collecting comprehensive prognostic data. By integrating many of the sensing elements required for effective prognostic life estimation within a single tiny device, the invasiveness and expense associated with implementing condition-based maintenance practices can be dramatically reduced. The proposed MEMS-based module will record temperature, humidity, vibration/shock and stress/strain data for processing via prognostic algorithms. Key tasks of this Phase I effort include: - Design and Integration of multiple MEMS sensing elements operating in close proximity aboard a single silicon chip. - Development of signal conditioning circuitry tailored for driving and recording data from the prognostic MEMS sensing system. - Optimizing power usage based on data sampling rate and duration required for each specific application. - Creating an overall package design that encompasses the sensor, electronics, and communications in form factor that can be noninvasively deployed aboard most platforms. In phase I, a prototype MEMS sensor will be fabricated and parameter sensing will be verified. This provides the groundwork for the development of a deployable, near-final-scale prototype module in Phase II.

* Information listed above is at the time of submission. *

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