Design and Fabrication Techniques for 3-Dimensional Integrated Circuits

Award Information
Agency:
Department of Defense
Branch
n/a
Amount:
$750,000.00
Award Year:
2010
Program:
SBIR
Phase:
Phase II
Contract:
HR0011-10-9-0011
Award Id:
91892
Agency Tracking Number:
09SB1-0133
Solicitation Year:
2009
Solicitation Topic Code:
SB091-008
Solicitation Number:
2009.1
Small Business Information
5821 Sky Park Dr., Plano, TX, -
Hubzone Owned:
N
Minority Owned:
Y
Woman Owned:
Y
Duns:
828058508
Principal Investigator:
Nisha Checka
CEO/Founder
(617) 500-5481
nisha@goofyfootlabs.com
Business Contact:
Nisha Checka
CEO/Founder
(617) 500-5481
nisha@goofyfootlabs.com
Research Institute:
n/a
Abstract
The 3-D integration of systems through monolithic wafer stacking is an emerging technology that can alleviate power, delay, and area problems for digital circuits and can enable a host of new applications in the system on a chip design space. Currently, CAD tools for 3-D integration are severely lacking stagnating potentially explosive growth of the technology. GoofyFoot Labs proposes TESI3d, a CAD tool to efficiently and accurately explore the complex 3-D design space. We will develop a full-scale prototype, which will then be used to design and evaluate 3-D systems.

* information listed above is at the time of submission.

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