VLSI Compatible Silicon-on-Insulator Plasmonic Components

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA9550-09-C-0209
Agency Tracking Number: F08B-T18-0215
Amount: $100,000.00
Phase: Phase I
Program: STTR
Awards Year: 2010
Solicitation Year: 2008
Solicitation Topic Code: AF08-BT18
Solicitation Number: 2008.B
Small Business Information
8130 Shaffer Parkway, Littleton, CO, 80127
DUNS: 040245305
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Russell Hollingsworth
 Senior scientist
 (303) 285-5154
 rhollingsworth@itnes.com
Business Contact
 Debra Werges
Title: Contract administration
Phone: (303) 285-5129
Email: dwerges@itnes.com
Research Institution
 Colorado School of Mines
 Ralph L Brown
 1500 Illinois St.
Golden, CO, 80401
 (303) 273-3538
 Nonprofit college or university
Abstract
This Small Business Technology Transfer Phase I project will develop ultradense, low-power plasmonic integration components and devices for on-chip manipulation and processing of optical signals. Both passive and active components will be studied. Detailed performance predictions will be obtained through finite element modeling (FEM) of the harmonic Maxwell’s equations. The FEM provides detailed field information, including E field, B field, energy density, and time dependent information with subwavelength resolution, which greatly aids in understanding the underlying physical mechanisms. Test structures will be made using well established nanofabrication facilities, and characterized with spectral and polarization sensitive far field techniques. BENEFIT: The availability of ultradense plasmonic integration components that are compatible with VLSI processing will allow for optical manipulation to be performed on-chip. New and more powerful optoelectronic devices will be enabled by these developments.

* Information listed above is at the time of submission. *

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