VLSI Compatible Silicon-on-Insulator Plasmonic Components

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$100,000.00
Award Year:
2010
Program:
STTR
Phase:
Phase I
Contract:
FA9550-09-C-0209
Award Id:
94930
Agency Tracking Number:
F08B-T18-0215
Solicitation Year:
n/a
Solicitation Topic Code:
AF 08TT18
Solicitation Number:
n/a
Small Business Information
8130 Shaffer Parkway, Littleton, CO, 80127
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
040245305
Principal Investigator:
Russell Hollingsworth
Senior scientist
(303) 285-5154
rhollingsworth@itnes.com
Business Contact:
Debra Werges
Contract administration
(303) 285-5129
dwerges@itnes.com
Research Institution:
Colorado School of Mines
Ralph L Brown
1500 Illinois St.
Golden, CO, 80401
(303) 273-3538
Nonprofit college or university
Abstract
This Small Business Technology Transfer Phase I project will develop ultradense, low-power plasmonic integration components and devices for on-chip manipulation and processing of optical signals. Both passive and active components will be studied. Detailed performance predictions will be obtained through finite element modeling (FEM) of the harmonic Maxwell's equations. The FEM provides detailed field information, including E field, B field, energy density, and time dependent information with subwavelength resolution, which greatly aids in understanding the underlying physical mechanisms. Test structures will be made using well established nanofabrication facilities, and characterized with spectral and polarization sensitive far field techniques. BENEFIT: The availability of ultradense plasmonic integration components that are compatible with VLSI processing will allow for optical manipulation to be performed on-chip. New and more powerful optoelectronic devices will be enabled by these developments.

* information listed above is at the time of submission.

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