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Alignment Tolerant Optical Connector with Active Regenerative Element
Award Information
Agency: Department of Defense
Branch: Army
Contract: W911NF-14-C-0005
Agency Tracking Number: A2-5450
Amount:
$374,852.00
Phase:
Phase II
Program:
STTR
Solicitation Topic Code:
A12A-T008
Solicitation Number:
2012.A
Timeline
Solicitation Year:
2012
Award Year:
2013
Award Start Date (Proposal Award Date):
2013-11-01
Award End Date (Contract End Date):
2014-11-01
Small Business Information
990 Park Center Drive, Suite H, Vista, CA, -
DUNS:
199060521
HUBZone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Principal Investigator
Name: Charles Kuznia
Title: President
Phone: (760) 652-0007
Email: ckuznia@ultracomm-inc.com
Title: President
Phone: (760) 652-0007
Email: ckuznia@ultracomm-inc.com
Business Contact
Name: Charles Kuznia
Title: President
Phone: (760) 652-0007
Email: ckuznia@ultracomm-inc.com
Title: President
Phone: (760) 652-0007
Email: ckuznia@ultracomm-inc.com
Research Institution
Name: WVHTCF
Contact: Brian Lemoff
Address: 1000 Technology Dr, Ste 100
Fairmont, WV, 26554-
Phone: (304) 333-6442
Type: Federally funded R&D center (FFRDC)
Contact: Brian Lemoff
Address: 1000 Technology Dr, Ste 100
Fairmont, WV, 26554-
Phone: (304) 333-6442
Type: Federally funded R&D center (FFRDC)
Abstract
This program creates a new class of advanced transceiver techology. This technology can create 40 Gbps VCSEL-based micro-transceiver (uTRX) components that operate reliably over the standard military temperature range of -55°C to 125°C in Army environments. uTRXs are low-cost, compact components that can be assembled onto the PCB in close proximity to high-performance ASICs using conventional solder-reflow'pick-and-place'assembly. The small PCB footprint and solderability is necessary to achieve high-density and flexible placement of optical components near the data source/sink. By reducing the routing lengths of high-speed copper wiring, we can achieve low-power, EMI-immune links within high-performance military computing and sensor systems. * Information listed above is at the time of submission. *