Tin Whisker Mitigation Technologies for Sn-based Surface Finishes on Electronic Assemblies and Microelectronic Devices

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: HQ0006-10-C-7204
Agency Tracking Number: B2-1651
Amount: $2,328,560.00
Phase: Phase II
Program: STTR
Solicitation Topic Code: MDA08-T010
Solicitation Number: 2008.B
Solicitation Year: 2008
Award Year: 2010
Award Start Date (Proposal Award Date): 2010-04-30
Award End Date (Contract End Date): 2012-04-29
Small Business Information
1982 S. Elizabeth St., Kokomo, IN, 46902-
DUNS: 791785538
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Terry Munson
 (765) 457-8095
Business Contact
 Sandy Wheeler
Title: Financial Manager
Phone: (765) 457-8095
Email: sandyw@residues.com
Research Institution
 Purdue University
 Carol Handwerker
 School of Materials Engrg.
W. Lafayette, IN, 47907-
 (765) 494-0147
 Nonprofit college or university
The impact of metal whiskers on the reliability of electronics has been exacerbated by environmentally-driven efforts to eliminate lead from tin plating and solders. Even exempt applications, such as military, are affected due to COTS. Foresite, Inc., a consultant, laboratory and test equipment development company, has a goal for the subject research, in collaboration with Purdue University, to develop a valid, accelerated test that will measure the susceptibility of a surface to whisker nucleation and growth, particularly through the introduction of known, controlled, surface contamination to act as an accelerant. Foresite research indicates a correlation between ionic residue levels and whisker growth. Phase I produced whisker activity on tin plated, 65°C test samples, in 5 days equal to that activity produced in 42 days of thermal-cycling JEDEC tests. In addition, differentiating whisker results were produced between five plating solutions, aligning with expectations based on previous Purdue research. Whisker samples and accelerated test protocol elements were produced in Phase I. In Phase II these samples will be further analyzed and test elements refined, leading to a final, documented and validated, accelerated, whisker test method. It is planned that a new sensor, based on this technology, will be developed in Phase III.

* Information listed above is at the time of submission. *

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