BOND-M: Bond Observation and Non-Destructive Measurement Technique

Award Information
Agency:
Department of Defense
Branch
Defense Advanced Research Projects Agency
Amount:
$99,863.00
Award Year:
2013
Program:
SBIR
Phase:
Phase I
Contract:
W911QX-13-C-0036
Agency Tracking Number:
D123-001-0005
Solicitation Year:
2012
Solicitation Topic Code:
SB123-001
Solicitation Number:
2012.3
Small Business Information
SCIENCETOMORROW, LLC
PO Box 7562, Woodbridge, VA, -
Hubzone Owned:
N
Socially and Economically Disadvantaged:
Y
Woman Owned:
Y
Duns:
829225791
Principal Investigator:
Subhadarshi Nayak
Chief Technology Officer
(877) 203-7673
nayak@sciencetomorrow.biz
Business Contact:
Jyoti Agrawal
President
(877) 203-7673
jyoti.agrawal@sciencetomorrow.biz
Research Institution:
n/a
Abstract
ScienceTomorrow proposes to develop a novel Bond Observation and Non-Destructive Measurement (BOND-M) technique for measuring bond strength of adhesively joined composites. BOND-M will employ high-intensity focused ultrasound stress waves directed at a small region within the adhesive layer to rapidly proof test the bond while simultaneously observing for bond damage and defects and verifying successful bonding. The BOND-M device, positioned on a surface, can steer the focused beam to proof test the bond at multiple locations deep inside or on the edge of the composite structure. By traversing the device parallel to the longer dimension of a composite primary structure, entire bond-joints can be tested rapidly. Local quantitative bond strength measurement can be used for process control and monitoring. Validation of the bond strength measurement will be accomplished by employing a destructive method on identical samples. BOND-M measurement with a statistical sampling scheme will enable rapid aviation certification while maintaining the structural integrity of composites and helping to prevent surprise failures.

* information listed above is at the time of submission.

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