Reworkable Epoxy Bonding for Superconductor Multi-chip Modules

Award Information
Agency:
Department of Defense
Amount:
$719,751.00
Program:
STTR
Contract:
N00014-14-C-0077
Solitcitation Year:
2012
Solicitation Number:
2012.1
Branch:
Navy
Award Year:
2014
Phase:
Phase II
Agency Tracking Number:
N12A-014-0258
Solicitation Topic Code:
N12A-T014
Small Business Information
HYPRES. Inc.
175 Clearbrook Road, Elmsford, NY, 10523
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
000000000
Principal Investigator
 Deepnarayan Gupta
 VP, RF Circuits and Syste
 (914) 592-1190
 gupta@hypres.com
Business Contact
 Steve Damon
Title: Assistant Controller
Phone: (914) 592-1190
Email: sdamon@hypres.com
Research Institution
 University of Arkansas
 Dennis Brewer
 210 Administration Building
Fayetteville, AR, 72701-1201
 (479) 575-3845
 Nonprofit college or university
Abstract
HYPRES, in collaboration with University of Arkansas (UA), proposes to develop a method for manufacturing superconductor multi-chip modules (MCMs) using nano-engineered cryogenic adhesives. A superconductor MCM comprises a carrier and several flipped chips. Before final assembly on the carrier, these chips need to be screened by temporarily attaching each one to another carrier with active test circuitry. Therefore, a detachable die attachment process is needed for selecting a set of known good die. This was achieved in Phase I and will be further refined in Phase II to ensure high reliability and robustness. Furthermore, a new method of selective detachment and replacement of a single chip from an MCM will be developed in Phase II. MCMs of increasing complexity will be developed for different target naval applications including multi-input RF receivers.

* information listed above is at the time of submission.

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