Reworkable Epoxy Bonding for Superconductor Multi-chip Modules

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$479,427.00
Award Year:
2014
Program:
STTR
Phase:
Phase II
Contract:
N00014-14-C-0077
Agency Tracking Number:
N12A-014-0258
Solicitation Year:
2012
Solicitation Topic Code:
N12A-T014
Solicitation Number:
2012.A
Small Business Information
HYPRES. Inc.
175 Clearbrook Road, Elmsford, NY, -
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
103734869
Principal Investigator:
Deepnarayan Gupta
VP, RF Circuits and Syste
(914) 592-1190
gupta@hypres.com
Business Contact:
Steve Damon
Assistant Controller
(914) 592-1190
sdamon@hypres.com
Research Institution:
University of Arkansas
Dennis W Brewer
210 Administration Building
Fayetteville, AR, 72701-1201
(479) 575-3845
Nonprofit college or university
Abstract
HYPRES, in collaboration with University of Arkansas (UA), proposes to develop a method for manufacturing superconductor multi-chip modules (MCMs) using nano-engineered cryogenic adhesives. A superconductor MCM comprises a carrier and several flipped chips. Before final assembly on the carrier, these chips need to be screened by temporarily attaching each one to another carrier with active test circuitry. Therefore, a detachable die attachment process is needed for selecting a set of known good die. This was achieved in Phase I and will be further refined in Phase II to ensure high reliability and robustness. Furthermore, a new method of selective detachment and replacement of a single chip from an MCM will be developed in Phase II. MCMs of increasing complexity will be developed for different target naval applications including multi-input RF receivers.

* information listed above is at the time of submission.

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