Enabling Flexible Materials, Devices and Processes for Defense

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$749,995.00
Award Year:
2014
Program:
SBIR
Phase:
Phase II
Contract:
FA8650-14-C-5010
Agency Tracking Number:
F121-003-1670
Solicitation Year:
2012
Solicitation Topic Code:
AF121-003
Solicitation Number:
2012.1
Small Business Information
American Semiconductor, Inc.
3100 S. Vista Ave., Suite 230, Boise, ID, 83705-
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
076338677
Principal Investigator:
Richard Chaney
General Manager
(208) 336-2773
richchaney@americansemi.com
Business Contact:
Lorelli Hackler
CFO
(208) 336-2773
lhackler@americansemi.com
Research Institution:
n/a
Abstract
ABSTRACT: Emergence and feasibility for flexible body-worn electronics and particularly medical patches requires high performance electronics capability. The problem is that these new technologies must have flexible and conformal physical formats and conventional electronic components are not in any way flexible. In the CLAS Phase I program, a new flexible high-performance manufacturing and materials system was demonstrated for feasibility. This system included high performance components integrated with printed substrates and printed antennas to support data processing and wireless communications in a flexible and conformal format. FleX silicon-on-polymer integrated circuits and printed devices such as the antenna demonstrated in the CLAS Phase I program have provided a feasible solution for flexible electronics and wireless applications. This Phase II will build on the Flexible Hybrid System (FHS) technology proven in the CLAS Phase I and will apply the technology to body-worn and bio-sensor applications. The output of this Phase II will be the manufacturing and materials methods required for producing this technology. The program includes the demonstration of the new capability with the production of FHS development kits that can be utilized to enable a wide variety of programs that demand high performance flexible electronics. The program includes an applied demonstration of the new capability by integrating an advanced printed ammonia biosensor on completed development kits. BENEFIT: BENEFITS Manufacturing capability for CLAS and other distributed sensor defense applications. Development Kits that can be used by sensor/product teams developing body-worn electronics. Establishment of U.S. manufacturing capability at the leading edge of flexible electronics. Development of new flexible electronics assembly capability and technology. Development of new flexible electronics materials. COMMERCIAL APPLICATIONS Major commercial products companies desire to introduce ultra-thin and flexible consumer and medical electronics to the market. This includes products with flexible OLED displays, body-worn sensors, smart clothing with wireless communication and the conversion of a number of common devices such as tablets and cell phones to flexible versions. The technology in this Phase II is enabling for all of these applications.

* information listed above is at the time of submission.

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