Electronic Component Fingerprinting to Determine Manufacturing Origin
Small Business Information
7702 E. Doubletree Ranch Rd., Ste. 300, Scottsdale, AZ, 85258
AbstractIn the area of supply chain integrity improvement, the US defense and intelligence sectors anticipate multiple uses for the forensic capability to characterize an electronic component for the purpose of identifying the semiconductor fabrication facility where the component was manufactured. In this Direct-to-Phase II effort, FabMetrix (formerly NanoTEM) proposes to expand an existing Department of Defense SBIR-developed diagnostic technology to offer such manufacturing forensic capability by leveraging its key components of nanoscale structural, compositional, mechanical and electrical characterization methodologies. The required expansion of this transmission electron microscopy-based technology will be carried out through: (a) identification, extraction and exploitation of suitable physical parametrics as manufacturer-specific fingerprints, and (b) generation, compilation and optimization of reference manufacturer-specific fingerprint libraries as the basis for the above capability.
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