Hard X-ray Area Detector Using Direct Converter Layer

Award Information
Agency:
Department of Energy
Branch
n/a
Amount:
$147,192.03
Award Year:
2014
Program:
SBIR
Phase:
Phase I
Contract:
DE-SC0011320
Award Id:
n/a
Agency Tracking Number:
209727
Solicitation Year:
2014
Solicitation Topic Code:
03a
Solicitation Number:
DE-FOA-0000969
Small Business Information
Radiation Monitoring Devices, Inc. (Currently Radiation Monitoring Devices, Inc)
44 Hunt Street, Watertown, MA, 02472-4699
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
073804411
Principal Investigator:
Paul Bennett
Mr.
(617) 668-6831
pbennett@rmdinc.com
Business Contact:
Kanai Shah
Mrs.
(617) 668-6845
kshah@rmdinc.com
Research Institution:
Stub




Abstract
Synchrotron radiation is a powerful tool for measuring structural properties of materials. Important applications of higher energy synchrotron X-rays include measurement of strain and material evolution during processing, studies of composite materials and studies of layered systems such as environmental-barrier coatings, metal- nitride coatings and solid oxide fuel cells. Detector requirements for these applications include large area, high sensitivity, wide dynamic range, high spatial resolution and fast response. None of the existing detectors meet all of these requirements. We propose to develop a direct detection imager consisting of a compound semiconductor layer coupled to an amorphous silicon thin film transistor array. This detector promises to have higher sensitivity and higher spatial resolution than indirect detectors currently in use. In addition, a low-cost method that can easily be scaled to large areas will be employed to couple the semiconductor layer to the read out array. Commercial Applications and Other Benefits: In addition to the synchrotron applications mentioned above, a high resolution, large area detector would have important applications in X-ray diffraction and medical imaging including breast tomosynthesis and portal imaging.

* information listed above is at the time of submission.

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