Anti-Tamper Active and Passive Sensors for Use Inside an Integrated Circuit

Award Information
Agency: Department of Defense
Branch: Army
Contract: W31P4Q-07-C-0084
Agency Tracking Number: A062-030-2827
Amount: $70,000.00
Phase: Phase I
Program: SBIR
Awards Year: 2006
Solicitation Year: 2006
Solicitation Topic Code: A06-030
Solicitation Number: 2006.2
Small Business Information
3533 Albatross Street, San Diego, CA, 92103
DUNS: 836003459
HUBZone Owned: N
Woman Owned: Y
Socially and Economically Disadvantaged: N
Principal Investigator
 Lowell Smith
 Principal Scientist
 (858) 495-0189
 lowell.smith@ieee.org
Business Contact
 Christine Murphy
Title: President, Conracts Manager &FSO
Phone: (619) 692-9476
Email: cmm@accordsol.com
Research Institution
N/A
Abstract
The innovative in-chip sensor technology, integrated chip protection (ICP), proposed by Accord provides a new hardware design and production technique to delay reverse engineering and exploitation, denying an adversary information about the chip design. The target product is a device that secures integrated circuits from reverse engineering. Intrusive attacks, including minute modifications to a covering package, are detected by the proposed active sensing layer, which responds accordingly. Thus, the ICP anti-tamper technology provides very high sensitivity to physical tampering intrusion attacks. Integrated sensor and detection processing provides false alarm rejection and compensation for the environment’s impact on the sensor. In addition, the innovation provides sensitive layers that can detect X-ray or other penetrating radiation that have impinged on the integrated circuit substrate and its package. If exposed to imaging levels of radiation during quiescence this detection layer enables secure circuit activation only if there has been no intrusion during the interim between powered missions.

* Information listed above is at the time of submission. *

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