Anti-Tamper Active and Passive Sensors for Use Inside an Integrated Circuit

Award Information
Agency:
Department of Defense
Branch
Army
Amount:
$70,000.00
Award Year:
2006
Program:
SBIR
Phase:
Phase I
Contract:
W31P4Q-07-C-0084
Agency Tracking Number:
A062-030-2827
Solicitation Year:
2006
Solicitation Topic Code:
A06-030
Solicitation Number:
2006.2
Small Business Information
ACCORD SOLUTIONS INC
3533 Albatross Street, San Diego, CA, 92103
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
Y
Duns:
836003459
Principal Investigator:
Lowell Smith
Principal Scientist
(858) 495-0189
lowell.smith@ieee.org
Business Contact:
Christine Murphy
President, Conracts Manager &FSO
(619) 692-9476
cmm@accordsol.com
Research Institution:
n/a
Abstract
The innovative in-chip sensor technology, integrated chip protection (ICP), proposed by Accord provides a new hardware design and production technique to delay reverse engineering and exploitation, denying an adversary information about the chip design. The target product is a device that secures integrated circuits from reverse engineering. Intrusive attacks, including minute modifications to a covering package, are detected by the proposed active sensing layer, which responds accordingly. Thus, the ICP anti-tamper technology provides very high sensitivity to physical tampering intrusion attacks. Integrated sensor and detection processing provides false alarm rejection and compensation for the environment’s impact on the sensor. In addition, the innovation provides sensitive layers that can detect X-ray or other penetrating radiation that have impinged on the integrated circuit substrate and its package. If exposed to imaging levels of radiation during quiescence this detection layer enables secure circuit activation only if there has been no intrusion during the interim between powered missions.

* information listed above is at the time of submission.

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