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Next Generation Rad Hard Reduced Instruction Set Computer

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA9453-14-M-0135
Agency Tracking Number: F141-097-1707
Amount: $149,611.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: AF141-097
Solicitation Number: 2014.1
Solicitation Year: 2014
Award Year: 2014
Award Start Date (Proposal Award Date): 2014-06-20
Award End Date (Contract End Date): 2015-03-02
Small Business Information
1415 Bond St. #111
Naperville, IL 60563-
United States
DUNS: 844118195
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Robert Patti
 (630) 505-0404
Business Contact
 Robert Patti
Title: CTO
Phone: (630) 505-0404
Research Institution

ABSTRACT: Tezzaron proposes to create a microprocessor device based on an ARM M0 processor designed to be fabricated in the Honeywell S150 Rad-Hard SOI semiconductor process. The device will be designed for both stand alone and 3D circuit integration. In a 3D application the device can be die to wafer or wafer to wafer assembled providing a core set of SOC processor functions. BENEFIT: An ARM M0 processor device that is hardened has broad applicability to the Mil-Aerospace market. The performance of the M0 processor makes it a good candidate for real time flight control and the 3D integration feature can provided unparalleled performance at low power.

* Information listed above is at the time of submission. *

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