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Optically Transparent Inorganic Conductive Polymer-Based Flexible Material System for ITO Repair
Title: Director, Process Engineering
Phone: (310) 530-2011
Phone: (310) 530-2011
ABSTRACT: InnoSense LLC (ISL), in this project, will demonstrate the feasibility of an ITO repair method that can be applied under ambient conditions. Upon reviewing the state-of-the-art techniques, ISL focused on developing a repairing matrix that promotes strong adhesion of ITO-compatible material system to repair irregular scratches and nicks that can occur during routine missions. Using electrohydrodynamic spray deposition, followed by thermal curing, ISL will make sure that the damages are filled seamlessly with matching optical and shielding capabilities. In Phase I, ISL will demonstrate feasibility by applying ITO alternatives to scratched ITO-coated polycarbonate coupons to restore their optical and electrical properties. In Phase II, ISL will improve the synthesis of the material matrix, produce and deliver 1 kg of material and demonstrate the scratch repair of ITO coatings (scratches representing different depths and widths) without scattering or loss of continuity, guided by testing to both MIL-STD-810E and MIL-C-48497 protocols. During the transition to Phase III, ISL will work with USAF and prime contractors to establish flight and other field testing requirements needed to certify the coatings. Testing will include extensive surface and volume resistivity, and EMI shielding and actual flight tests to determine product performance in field environments. BENEFIT: Military and commercial applications overlap for ITO repair. Applications include the dissipation of and shielding from incident energy for aircraft windows and canopies, display technologies, opto-electronic devices, cell phone displays, computer touch screens, and solar panels. All of the technologies require continuous transparent conductive coatings in order to function properly. Each industry has its own requirements and specifications for both the coating and repair.
* Information listed above is at the time of submission. *