Hybridization Techniques for Ultra-Small Pitch Focal Plane Arrays

ABSTRACT: High-yielding inkjet print (IJP) deposition technologies will be developed for hybridizing the ultra-small pitch semiconductor detector arrays and readout integrated circuits (ROIC). The goal is to develop a method, alternative to the thermocompression hybridization methods currently used, that can be used to hybridize high pixel density focal plane arrays (FPAs), with 5 micron, and smaller, pixel pitch, using low-cost processes requiring lower force and lower temperature processes. In Phase I, the materials and processes will be developed. Then, using test structures, the hybridization process will be optimized. It will be shown how the micron-scale resolution of IJP equipment, with nanoimprint (NI) lithography can be used to create a high-yielding additive hybridization process. After the materials and process are developed, an FPA will be hybridized using functional ROICs and semiconductor detector arrays. BENEFIT: The innovation can be used by military focal plane manufacturers for hybridizing the next generation of infrared (IR) FPAs. The technologies can also be used for fabricating low-cost three-dimensional stacked circuits from dissimilar materials, allowing for high-density stacked circuits to be available for a large number of applications.