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Hybridization Techniques for Ultra-Small Pitch Focal Plane Arrays

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8650-14-M-1789
Agency Tracking Number: F141-196-1979
Amount: $149,997.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: AF141-196
Solicitation Number: 2014.1
Solicitation Year: 2014
Award Year: 2014
Award Start Date (Proposal Award Date): 2014-06-05
Award End Date (Contract End Date): 2015-03-05
Small Business Information
15985 NW Schendel Avenue Suite 200
Beaverton, OR 97006-
United States
DUNS: 124348652
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Drake Miller
 Senior Engineer
 (971) 223-5646
Business Contact
 George Williams
Title: President
Phone: (971) 223-5646
Research Institution

ABSTRACT: High-yielding inkjet print (IJP) deposition technologies will be developed for hybridizing the ultra-small pitch semiconductor detector arrays and readout integrated circuits (ROIC). The goal is to develop a method, alternative to the thermocompression hybridization methods currently used, that can be used to hybridize high pixel density focal plane arrays (FPAs), with 5 micron, and smaller, pixel pitch, using low-cost processes requiring lower force and lower temperature processes. In Phase I, the materials and processes will be developed. Then, using test structures, the hybridization process will be optimized. It will be shown how the micron-scale resolution of IJP equipment, with nanoimprint (NI) lithography can be used to create a high-yielding additive hybridization process. After the materials and process are developed, an FPA will be hybridized using functional ROICs and semiconductor detector arrays. BENEFIT: The innovation can be used by military focal plane manufacturers for hybridizing the next generation of infrared (IR) FPAs. The technologies can also be used for fabricating low-cost three-dimensional stacked circuits from dissimilar materials, allowing for high-density stacked circuits to be available for a large number of applications.

* Information listed above is at the time of submission. *

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